ExSolve

ExSolve

ExSolve is an automated, high-throughput sample preparation workflow for transmission electron microscopy (TEM) analysis. The ExSolve wafer TEM prep (WTP) dramatically reduces the cost and increases the speed of sample preparation, providing semiconductor and data storage manufacturers with quick and easy access to the data they need to verify and monitor process performance. ExSolve can prepare site-specific TEM lamella, sampling many sites per wafer in a fully-automated process inside the fab, giving semiconductor manufacturers much more information than conventional approaches, while at the same time reducing the capital cost of sample preparation by up to 70 percent.

Scios

Scios

FEI Scios™ is an ultra-high-resolution analytical DualBeam™ system that delivers outstanding 2D and 3D performance for a broad range of samples, including magnetic material. With innovative features designed to increase throughput, precision, and ease of use, the FEI Scios is ideal for advanced research and analysis across academic, government, and industrial research environments. Advanced detection technology is at the very core of the FEI Scios. In-lens FEI Trinity™ detection technology collects all signals simultaneously, saving time and offering distinctly different contrasts to capture the maximum amount of data. An innovative, under-the-lens concentric backscatter detector enhances efficiency, enabling you to select a signal based on its angular distribution to easily separate materials and topographic contrast-even at 20 eV landing energy.

CLM-3D

CLM-3D

The CLM-3D 300mm DualBeam is a full wafer autoloading system for automated, digital 3D analysis of semiconductor devices in a clean room environment. It combines FEI's latest generation electron column and high-current ion column to provide high precision cross-sectional metrology.

Versa 3D

Versa 3D

Building on the history and success of FEI's pioneering DualBeam, high-resolution, low vacuum and ESEM™ expertise, FEI introduces the most versatile DualBeam instrument to date. The Versa 3D offers state-of-the-art imaging and analytical performance to deliver a greater range of 3D data from even your most challenging samples. Versa 3D's highly configurable platform allows customers to adapt the system's capabilities to their specific requirements. The high vacuum-only version is ideal for routine conductive or coated samples and can be optionally equipped with a UC FEG to increase low kV performance. An alternative version, combining high and low vacuum modes, gives the flexibility to work with a range of samples including uncoated, non-conductive samples. Optional ESEM mode allows electron beam imaging of naturally hydrated samples and supports in situ analysis and experimentation with additional dynamic temperature stages.

Certus-3D

Certus-3D

The CLM-3D 300mm DualBeam is a full wafer autoloading system for automated, digital 3D analysis of semiconductor devices in a clean room environment. It combines FEI's latest generation electron column and high-current ion column to provide high precision cross-sectional metrology.

Helios Nanolab

Helios Nanolab

The Helios NanoLab™ DualBeam™ has always combined FEI's best electron and ion optics, accessories and software to deliver a powerful solution for advanced nanoscale research. For scientists working at nanotechnology's leading edge, Helios NanoLab lets them push boundaries and create new possibilities for materials research. With highly valued sub-nm SEM imaging, the capability to produce ultra-thin samples for S/TEM, and the most precise prototyping capabilities, scientists choose the Helios NanoLab as their partner for innovating new materials and nanoscale devices that will influence future advancements.

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